571-4015 и другие
| Компонент | Описание | Производитель | |
| 0440671401 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB |
Molex Electronics Ltd. |
 |
| 06171401 | tyco electronics contents |
Tyco Electronics |
|
| 0757571401 | 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5lm (60l) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length |
Molex Electronics Ltd. |
|
| 0908971401 | 2.54mm (.100) Pitch QF-50, Right Angle, Dual Row with Eject Levers, Shrouded Header |
Molex Electronics Ltd. |
|
| 2157-140-10-50 | Bandpass Filter |
KR Electronics, Inc. |
|
| 271401B | SAW Bandpass Filter |
Integrated Technology Future |
|
| 44067-1401 | 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB |
Molex Electronics Ltd. |
|
| 571-4015 | Insulated solder terminal, Turreted |
CAMBION Electronic Components |
|
| 571-4016 | Insulated solder terminal, Turreted |
CAMBION Electronic Components |
|
| 5962F9671401VEC | Radiation Hardened Dual J-K Flip-Flop |
Intersil Corporation |
|