B272-110 и другие
| Компонент | Описание | Производитель | |
| 0022272111 | 2.54mm (.100) Pitch KK^ Wire-to-Board Header, Vertical, with Friction Lock, 11 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
 |
| 0758272114 | 1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX^ Backplane Connector System, Left Guide Header, 40 Circuits, Gold (Au) 0.76lm (30l), Pin Length 4.55mm (.179) |
Molex Electronics Ltd. |
|
| 42R02-7211 | IEC 60320 C14 APPL. INLET; QUICK CONNECT TERMINALS; SIDE FLANGE |
PowerDynamics, Inc |
|
| 75827-2114 | 1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX^ Backplane Connector System, Left Guide Header, 40 Circuits, Gold (Au) 0.76lm (30l), Pin Length 4.55mm (.179) |
Molex Electronics Ltd. |
|
| ALD2721_11 | DUAL EPAD^ MICROPOWER CMOS OPERATIONAL AMPLIFIER |
Advanced Linear Devices |
|
| B272-110 | Silicon Rectifier Miniature Single Phase Bridges |
Edal Industries, Inc. |
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| C1632C27211RAC | CERAMIC CHIP CAPACITORS |
Kemet Corporation |
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| CY24272_11 | Rambus XDR Clock Generator with Zero SDA Hold Time |
Cypress Semiconductor |
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| HF9318-027-2-1-1-1-1 | 1/2 CRYSTAL CAN HERMETICALLY SEALED RF RELAY |
Hongfa Technology |
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| HF9318-027-2-1-1-1-2 | 1/2 CRYSTAL CAN HERMETICALLY SEALED RF RELAY |
Hongfa Technology |
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