1782-63J и другие
| Компонент | Описание | Производитель | |
| 0737826300 | 2.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Closed End Option, 72 Circuits |
Molex Electronics Ltd. |
 |
| 1782-63J | Molded Unshielded RF Coils |
API Delevan |
|
| 73782-6300 | 2.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Closed End Option, 72 Circuits |
Molex Electronics Ltd. |
|