1782-73J и другие
| Компонент | Описание | Производитель | |
| 0737827300 | 2.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise VerticalSMC, Closed End Option, 144 Circuits |
Molex Electronics Ltd. |
 |
| 1782-73J | Molded Unshielded RF Coils |
API Delevan |
|
| 478-2730-1 | Thin-Film Technology |
AVX Corporation |
|
| 478-2730-1-ND | Thin-Film Technology |
AVX Corporation |
|
| 478-2730-2 | Thin-Film Technology |
AVX Corporation |
|
| 478-2730-2-ND | Thin-Film Technology |
AVX Corporation |
|
| 478-2731-1 | Thin-Film Technology |
AVX Corporation |
|
| 478-2731-1-ND | Thin-Film Technology |
AVX Corporation |
|
| 478-2731-2 | Thin-Film Technology |
AVX Corporation |
|
| 478-2731-2-ND | Thin-Film Technology |
AVX Corporation |
|