0440670601 Datasheet

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0440670601 - 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating




Название/Part No:
0440670601

Описание/Description:
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating

Производитель/Maker:
Molex Electronics Ltd. (MOLEX)

Ссылка на datasheet:

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0440670601 и другие

Компонент Описание Производитель PDF
0440670601
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
0440670602
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
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0440670603
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
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44067-0601
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
44067-0602
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
Molex Electronics Ltd.
44067-0603
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
Molex Electronics Ltd.

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