E8267D и другие
| Компонент | Описание | Производитель | |
| 015-05-8267 | IDT COVER |
Molex Electronics Ltd. |
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| 0513382674 | 0.40mm (.016") Pitch Board-to-Board SlimStack Receptacle, Surface Mount, DualRow, Vertical Stacking, 1.50mm (.059") Stacking Height, with Space Saving J-BendLeads, 26 Circuits, Lead-free |
Molex Electronics Ltd. |
|
| 0528082670 | 1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, Non-ZIF Receptacle, 26Circuits, Lead-free |
Molex Electronics Ltd. |
|
| 0545482671 | 0.50mm (.020") Pitch FFC/FPC Connector, 1.20mm (.047") Height, Right Angle, SMT ZIF, Bottom Contact Style, 26 Circuits, Lead-free, Gold (Au) Plating |
Molex Electronics Ltd. |
|
| 1782-67J | Molded Unshielded RF Coils |
API Delevan |
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| 282826-7 | TERMINAL BLOCK HEADER ASSEMBLY 180 Љ CLOSED ENDS 10mm PITCH |
Tyco Electronics |
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| 51338-2674 | 0.40mm (.016") Pitch Board-to-Board SlimStack Receptacle, Surface Mount, DualRow, Vertical Stacking, 1.50mm (.059") Stacking Height, with Space Saving J-BendLeads, 26 Circuits, Lead-free |
Molex Electronics Ltd. |
|
| 52808-2670 | 1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, Non-ZIF Receptacle, 26Circuits, Lead-free |
Molex Electronics Ltd. |
|
| 54548-2671 | 0.50mm (.020") Pitch FFC/FPC Connector, 1.20mm (.047") Height, Right Angle, SMT ZIF, Bottom Contact Style, 26 Circuits, Lead-free, Gold (Au) Plating |
Molex Electronics Ltd. |
|
| 5962-38267 | MICROCIRCUIT, MEMORY, DIGITAL, CMOS 128K x 8 BIT EEPROM, MONOLITHIC SILICON |
Maxwell Technologies |
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