1ML06-031-05 и другие
| Компонент | Описание | Производитель | |
| 1ML06-031-05 | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
 |
| 1ML06-031-05 | Thermoelectric Module |
RMT Ltd. |
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| 1ML06-031-05AN05 | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
|
| 1ML06-031-05T | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
|
| 1ML06-031-07AN05 | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
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| 1ML06-031-07T | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
|
| 1ML06-031-09 | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
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| 1ML06-031-09AN05 | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
|
| ACML-0603-1000 | SURFACE-MOUNT MULTI-LAYER CHIP BEADS |
Abracon Corporation |
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| CTML0603-100K | Multi-layer Chip Inductors - Ferrite |
Central Technologies |
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