H05N60 и другие
| Компонент | Описание | Производитель | |
| 3SBH5005N6 | 150 Grid-space Micro-miniature Relays |
Tyco Electronics |
 |
| 3SBM5005N6 | 150 Grid-space Relays Magnetic-latching |
Tyco Electronics |
|
| 3SBM6005N6 | 150 Grid-space Relays Magnetic-latching |
Tyco Electronics |
|
| B65805-N63-A33 | Core without center hole for transformer applications |
EPCOS |
|
| C0805N62031G4C | CERAMIC CHIP CAPACITORS |
Kemet Corporation |
|
| C0805N62931G4C | CERAMIC CHIP CAPACITORS |
Kemet Corporation |
|
| C0805N68031G4C | CERAMIC CHIP CAPACITORS |
Kemet Corporation |
|
| C0805N68131X4C | CERAMIC CHIP CAPACITORS |
Kemet Corporation |
|
| C0805N68931G4C | CERAMIC CHIP CAPACITORS |
Kemet Corporation |
|
| CE201210-5N6J | Multi-Layer Chip Inductors |
Bourns Electronic Solutions |
|