| Компонент | Описание | Производитель | |
| 1ML06-035-05AN05 | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
|
| 1ML06-035-05T | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
|
| 1ML06-035-07AN05 | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
|
| 1ML06-035-09 | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
|
| 1ML06-035-09AN05 | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
|
| 1ML06-035-09T | Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper |
RMT Ltd. |
|
| ACML-0603-500 | SURFACE-MOUNT MULTI-LAYER CHIP BEADS |
Abracon Corporation |