100158Y и другие
| Компонент | Описание | Производитель | |
| 000-15875 | BNC Connectors |
Amphenol Corporation |
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| 0014600158 | 2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 3.81lm (150l") Tin/Lead (SnPb) |
Molex Electronics Ltd. |
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| 0015800061 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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| 0015800063 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38lm (15l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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| 0015800065 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76lm (30l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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| 0015800067 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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| 0015800069 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating |
Molex Electronics Ltd. |
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| 0015800081 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
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| 0015800083 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38lm (15l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
|
| 0015800085 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76lm (30l) Gold (Au) Selective Plating |
Molex Electronics Ltd. |
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