RD3.0E и другие
| Компонент | Описание | Производитель | |
| 0192670131 | Perma-Fit Thin-Wall multi Purpose Heat Shrink Tubing, 3.18mm (.125") InsideDiameterRed30.48m (100.0 |
Molex Electronics Ltd. |
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| 0192670221 | Perma-Fit Thin-Wall multi Purpose Heat Shrink Tubing, 9.53mm (.375") InsideDiameter (As SuppliedRed30.48m100.0Length |
Molex Electronics Ltd. |
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| 0702473051 | 2.54mm (.100") Pitch C-Grid^ Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.38lm (15l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
Molex Electronics Ltd. |
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| 0702473052 | 2.54mm (.100") Pitch C-Grid^ Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
Molex Electronics Ltd. |
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| 0702473054 | 2.54mm (.100") Pitch C-Grid^ Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.127lm (5l") Gold (Au) Plating, Tin(Sn) PC TailPlating |
Molex Electronics Ltd. |
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| 0713492013 | 2.54mm (.100") Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, Shrouded30 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs |
Molex Electronics Ltd. |
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| 0713492047 | 2.54mm (.100") Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, Shrouded30 Circuits, 0.38lm (15l") Gold (Au) Selective Plating, with Press-fit Plastic Pegs |
Molex Electronics Ltd. |
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| 0713492081 | 2.54mm (.100") Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, Shrouded30 Circuits, 0.76lm (30l") Gold (Au) Selective Plating, with Press-fit Plastic Pegs |
Molex Electronics Ltd. |
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| 0809LD30 | 30 WATT, 28V, 1 GHz LDMOS FET |
List of Unclassifed Manufacturers |
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| 0809LD30P | 30 WATT, 28V, 1 GHz LDMOS FET |
List of Unclassifed Manufacturers |
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