S5870 datasheet - Multi-element photodiodes for surface mounting | S5870.pdf by Hamamatsu Corporation | S5870 documentation view on EHAM.RU

S5870 - Multi-element photodiodes for surface mounting

S5870 datasheet - Multi-element photodiodes for surface mounting

Название/Part No:

S5870

Описание/Description:

Multi-element photodiodes for surface mounting

Производитель/Maker:

Hamamatsu Corporation (HAMAMATSU)

Ссылка на datasheet:

S5870 и другие

Компонент	Описание	Производитель	PDF
000-15875	BNC Connectors	Amphenol Corporation
0015-91-0587	2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs	Molex Electronics Ltd.
0015445870	2.54mm (.100") Pitch C-Grid^ Receptacle, Through Hole, Dual Row, High Profile,Vertical, High-Temperature, 70 Circuits	Molex Electronics Ltd.
0015445872	2.54mm (.100") Pitch C-Grid^ Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 72 Circuits	Molex Electronics Ltd.
0015445874	2.54mm (.100") Pitch C-Grid^ Receptacle, Through Hole, Dual Row, High Profile,Vertical, High-Temperature, 74 Circuits	Molex Electronics Ltd.
0015445876	2.54mm (.100") Pitch C-Grid^ Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 76 Circuits	Molex Electronics Ltd.
0015445878	2.54mm (.100") Pitch C-Grid^ Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 78 Circuits	Molex Electronics Ltd.
001591-0587	2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs	Molex Electronics Ltd.
0015910587	2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs	Molex Electronics Ltd.
0015910587-ND	2.54mm (.100) Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs	Molex Electronics Ltd.