0015800703 Datasheet

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0015800703 - 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38lm (15l) Gold (Au) Selective Plating,

0015800703 datasheet - 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38lm (15l) Gold (Au) Selective Plating,



Название/Part No:
0015800703

Описание/Description:
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38lm (15l) Gold (Au) Selective Plating,

Производитель/Maker:
Molex Electronics Ltd. (MOLEX)

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0015800703 и другие

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0015800701
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, Tin (Sn) Plating
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0015800703
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38lm (15l) Gold (Au) Selective Plating,
Molex Electronics Ltd.
0015800705
2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76lm (30l) Gold (Au) Selective Plating
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