SSF-2 и другие
| Компонент | Описание | Производитель | |
| 05738 | HEATSINK CROSSFLOW, MINI MOD (40 HG, SLOTTED) |
Vicor Corporation |
 |
| 05738-2 | HEATSINK CROSSFLOW, MINI MOD (40 HG, SLOTTED) |
Vicor Corporation |
|
| 05812 | CROSSFLOW GROUNDING CLIP |
Vicor Corporation |
|
| 05812-5 | CROSSFLOW GROUNDING CLIP |
Vicor Corporation |
|
| 0736440002 | 2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits |
Molex Electronics Ltd. |
|
| 0736440004 | 2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 72 Circuits |
Molex Electronics Ltd. |
|
| 0736440008 | 2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position E, 72 Circuits |
Molex Electronics Ltd. |
|
| 0736440012 | 2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position G, 72 Circuits |
Molex Electronics Ltd. |
|
| 0736440016 | 2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits |
Molex Electronics Ltd. |
|
| 0736440017 | 2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits |
Molex Electronics Ltd. |
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