SP0610 и другие
| Компонент | Описание | Производитель | |
| 390AP061M08 | Submersible EMI/RFI Cable Sealing Backshell with Strain Relief |
Glenair, Inc. |
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| A67P0618 | 1M X 18, 512K X 36 LVTTL, Pipelined ZeBL SRAM |
AMIC Technology |
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| A67P06181E | 1M X 18, 512K X 36 LVTTL, Flow-through ZeBL SRAM |
AMIC Technology |
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| A67P06181E-6.5 | 1M X 18, 512K X 36 LVTTL, Flow-through ZeBL SRAM |
AMIC Technology |
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| A67P06181E-7.5 | 1M X 18, 512K X 36 LVTTL, Flow-through ZeBL SRAM |
AMIC Technology |
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| A67P06181E-8.5 | 1M X 18, 512K X 36 LVTTL, Flow-through ZeBL SRAM |
AMIC Technology |
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| A67P0618E | 1M X 18, 512K X 36 LVTTL, Pipelined ZeBL SRAM |
AMIC Technology |
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| A67P0618E-2.6 | 1M X 18, 512K X 36 LVTTL, Pipelined ZeBL SRAM |
AMIC Technology |
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| A67P0618E-2.8 | 1M X 18, 512K X 36 LVTTL, Pipelined ZeBL SRAM |
AMIC Technology |
|
| A67P0618E-3.2 | 1M X 18, 512K X 36 LVTTL, Pipelined ZeBL SRAM |
AMIC Technology |
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