X25080P и другие
| Компонент | Описание | Производитель | |
| 0430250800 | 3.00mm (.118") Pitch Micro-Fit 3.0 Receptacle Housing, Dual Row, 8 Circuits |
Molex Electronics Ltd. |
 |
| 2508051017Y0 | MULTI-LAYER CHIP BEAD |
Fair-Rite Products Corp. |
|
| 2508051027Y0 | MULTI-LAYER CHIP BEAD |
Fair-Rite Products Corp. |
|
| 2508051107Y0 | RF Power LDMOS Transistors |
Freescale Semiconductor, Inc |
|
| 2508051107Y0 | MULTI-LAYER CHIP BEAD |
Fair-Rite Products Corp. |
|
| 2508051217Y0 | MULTI-LAYER CHIP BEAD |
Fair-Rite Products Corp. |
|
| 2508051217Z0 | MULTI-LAYER CHIP BEAD |
Fair-Rite Products Corp. |
|
| 2508051527Y0 | MULTI-LAYER CHIP BEAD |
Fair-Rite Products Corp. |
|
| 2508052027Z0 | MULTI-LAYER CHIP BEAD |
Fair-Rite Products Corp. |
|
| 2508053007Y0 | MULTI-LAYER CHIP BEAD |
Fair-Rite Products Corp. |
|