44067-2402 Datasheet

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44067-2402 - 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 24 Circuits, 0.38lm (15l") Gold (Au) Selective Plating

44067-2402 datasheet - 3.00mm (.118



Название/Part No:
44067-2402

Описание/Description:
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 24 Circuits, 0.38lm (15l") Gold (Au) Selective Plating

Производитель/Maker:
Molex Electronics Ltd. (MOLEX)

Ссылка на datasheet:

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44067-2402 и другие

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0440672401
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
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3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 24 Circuits, 0.38lm (15l") Gold (Au) Selective Plating
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0440672403
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 24 Circuits, 0.76lm (30l") Gold (Au) Selective Plating
Molex Electronics Ltd.
44067-2401
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
Molex Electronics Ltd.
44067-2402
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 24 Circuits, 0.38lm (15l") Gold (Au) Selective Plating
Molex Electronics Ltd.
44067-2403
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 24 Circuits, 0.76lm (30l") Gold (Au) Selective Plating
Molex Electronics Ltd.

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