2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly

Molex Electronics Ltd.

2.54mm (.100") SL Interim Clip, 42 Circuits, Polarized

Molex Electronics Ltd.

1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower Header, Right Angle, 4Power Contacts, 24 Signal Contacts, Select Gold (Au) Plating, for 3.18mm (.125") Thick PC Board, with Guide Pockets

Molex Electronics Ltd.

1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower Header, Right Angle, 4 Power Contacts, 24

Molex Electronics Ltd.

1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower Header, Right Angle, 4 Power Contacts, 24 Signal Contacts, Select Gold (Au) Plating, for 1.57mm (.062") Thick PC Board

Molex Electronics Ltd.

2.54mm (.100") Pitch C-Grid^ Header, Surface Mount, Dual Row, Vertical, 24 Circuits1.50lm (59l") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

Molex Electronics Ltd.

HEADER ASSY, MOD II, UNSHRUDED, COMPLIANT PIN, DOUBLE, ROW .100 X .100C/L, WITH .025 SQ POSTS

Tyco Electronics

2.54mm (.100") Pitch SL Insulation Displacement Connector Assembly

Molex Electronics Ltd.

HEADER ASSY, MOD II, UNSHROUDED, COMPLIANT PIN, DOUBLE, ROW .100 X .100C/L, WITH .025 SQ POSTS

Tyco Electronics

Surface Mount, NTC Thermistors

Vishay Siliconix