74770 datasheet - 2 mm Modular Interconnect System | 74770.pdf by FCI connector | 74770 documentation view on EHAM.RU

74770 - 2 mm Modular Interconnect System

74770 datasheet - 2 mm Modular Interconnect System

Название/Part No:

74770

Описание/Description:

2 mm Modular Interconnect System

Производитель/Maker:

FCI connector (FCICONNECTOR)

Ссылка на datasheet:

74770 и другие

Компонент	Описание	Производитель	PDF
0011-18-4779	Anvil	Molex Electronics Ltd.
001118-4779	Anvil	Molex Electronics Ltd.
0011184779	Anvil	Molex Electronics Ltd.
0015477506	2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
0015477508	2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
0015477510	2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
0015477512	2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits	Molex Electronics Ltd.
0015477514	2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
0015477516	2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
0015477518	2.54mm (.100) Pitch C-Grid^ Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.