73644-2016 datasheet

73644-2016 - 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

Название/Part No:

73644-2016

Описание/Description:

2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

Производитель/Maker:

Molex Electronics Ltd. (MOLEX)

Ссылка на datasheet:

73644-2016 и другие

Компонент	Описание	Производитель	PDF
0736442016	2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B	Molex Electronics Ltd.
0736442017	2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits	Molex Electronics Ltd.
0736442018	2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits	Molex Electronics Ltd.
73644-2016	2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B	Molex Electronics Ltd.
73644-2017	2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits	Molex Electronics Ltd.
73644-2018	2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits	Molex Electronics Ltd.