70567-0137 datasheet

70567-0137 - 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76lm (30l) Gold (Au) Selective Plating

Название/Part No:

70567-0137

Описание/Description:

2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76lm (30l) Gold (Au) Selective Plating

Производитель/Maker:

Molex Electronics Ltd. (MOLEX)

Ссылка на datasheet:

~/70567-0137.pdf

70567-0137 и другие

Компонент	Описание	Производитель	PDF
0705670131	2.54mm (.100") Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 62 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
70567-0131	2.54mm (.100") Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 62 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
70567-0137	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76lm (30l) Gold (Au) Selective Plating	Molex Electronics Ltd.
70567-0138	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76lm (30l) Gold (Au) Selective Plating	Molex Electronics Ltd.
70567-0139	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76lm (30l) Gold (Au) Selective Plating	Molex Electronics Ltd.
A-70567-0130	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
A-70567-0131	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
A-70567-0132	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
A-70567-0133	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
A-70567-0134	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.

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