73644-1107 Datasheet

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73644-1107 - 2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 144 Circuits




Название/Part No:
73644-1107

Описание/Description:
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 144 Circuits

Производитель/Maker:
Molex Electronics Ltd. (MOLEX)

Ссылка на datasheet:

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73644-1107 и другие

Компонент Описание Производитель PDF
0736441101
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
Molex Electronics Ltd.
0736441107
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 144 Circuits
Molex Electronics Ltd.
73644-1101
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
Molex Electronics Ltd.
73644-1107
2.00mm (.079") Pitch HDM^ Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position D, 144 Circuits
Molex Electronics Ltd.

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