0015800181 datasheet

0015800181 - 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating

Название/Part No:

0015800181

Описание/Description:

2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating

Производитель/Maker:

Molex Electronics Ltd. (MOLEX)

Ссылка на datasheet:

~/0015800181.pdf

0015800181 и другие

Компонент	Описание	Производитель	PDF
0015800181	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
0015800183	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits	Molex Electronics Ltd.
0015800185	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76lm (30l) Gold (Au) Selective Plating	Molex Electronics Ltd.
0015800187	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating	Molex Electronics Ltd.
0015800189	2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38lm (15l) Gold, (Au) Selective Plating	Molex Electronics Ltd.

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0015800181 и другие

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