A-70567-0127 Datasheet
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A-70567-0127 и другие
| Компонент | Описание | Производитель | |
| 0705670120 | 2.54mm (.100") Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
|
| 0705670125 | 2.54mm (.100") Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
|
| 70567-0120 | 2.54mm (.100") Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
|
| 70567-0125 | 2.54mm (.100") Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
|
| A-70567-0120 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
|
| A-70567-0121 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
|
| A-70567-0123 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
|
| A-70567-0124 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
|
| A-70567-0125 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
|
| A-70567-0126 | 2.54mm (.100) Pitch C-Grid^ Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
Molex Electronics Ltd. |
