H7826P и другие
| Компонент | Описание | Производитель | |
| 0478260000 | SAK-series |
Weidmuller |
 |
| 0737826100 | 2.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Closed End Option, 72 Circuits |
Molex Electronics Ltd. |
|
| 0737826200 | 2.00mm (.079") Pitch 5-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Pin End Version, 40 Circuits, Pin Length 4.75mm (.187") |
Molex Electronics Ltd. |
|
| 0737826300 | 2.00mm (.079") Pitch HDM^ Board-to-Board Stacking Header, High Rise Vertical,SMC, Closed End Option, 72 Circuits |
Molex Electronics Ltd. |
|
| 1107826 | tyco electronics contents |
Tyco Electronics |
|
| 1782-61J | Molded Unshielded RF Coils |
API Delevan |
|
| 1782-63J | Molded Unshielded RF Coils |
API Delevan |
|
| 1782-65J | Molded Unshielded RF Coils |
API Delevan |
|
| 1782-67J | Molded Unshielded RF Coils |
API Delevan |
|
| 1782-69J | Molded Unshielded RF Coils |
API Delevan |
|